SEMI与TechSearch International共同出版的全球半导体封装材料展望中显示,2011年包括热接口材料在内的全球半导体封装材料市场总值将达228亿美元,2015年将进一步成长至257亿美元。其中层压基板(laminate Substrates)仍占最大比例,2011年总额预计为97亿美元,以单位数量来看,未来5年的年复 SEMI and TechSearch International co-published in the global semiconductor packaging materials Outlook shows that in 2011 the global semiconductor packaging materials, including thermal interface materials, the market value will reach 22.8 billion US dollars in 2015, will further grow to 25.7 billion US dollars. Among them, laminate substrates still account for the largest proportion, with a total estimated value of 9.7 billion U.S. dollars in 2011. In unit terms,