论文部分内容阅读
我厂每年有数以万计的电子元件要焊接,长期来,在焊接前要先用手工刮掉元件腿子上的氧化层,经烫锡后再焊接,浪费工时,对元件又有损坏。经对烫锡条件(温度,时间)及助焊剂成分优选,省去刮腿这项手工操作,元件可直接烫锡,提高工效12倍,杜绝了电子元件的损坏,提高了质量。目前,我厂90%的电子元件能用此项工艺,另有10%的元件没有解决,有待进一步研究。
Every year, our factory has tens of thousands of electronic components to be soldered. For a long time, the oxide layers on the legs of the components must be scraped off by hand before soldering. After being tinned and then soldered, the working hours are wasted and the components are damaged again. The hot tin conditions (temperature, time) and the flux composition optimization, eliminating the manual scraping leg, the components can be directly hot tin, improve work efficiency 12 times, to eliminate the damage to electronic components and improve the quality. At present, 90% of our electronic components can use this process, and another 10% of the components are not resolved, pending further study.