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使用Cr,Ta靶材,采用反应磁控溅射制备了不同Cr含量的Ta-Cr-N薄膜,对不同薄膜的化学结构、力学性能、耐磨性进行了分析比较。XRD、SEM、EDS、纳米压痕、球盘摩擦及划痕试验被用于测试薄膜的结构及力学性能。在TaN薄膜中掺杂Cr导致晶格常数及薄膜晶粒大小的降低。当Cr含量增加时,薄膜硬度,结合力及耐磨性都有所改善。当Ta-Cr-N薄膜中Cr含量达到29.5%时,薄膜显示了最高的硬度,最小的晶粒及最低的磨损率。
Ta-Cr-N films with different Cr content were prepared by reactive magnetron sputtering using Cr and Ta targets. The chemical structure, mechanical properties and wear resistance of different films were analyzed and compared. XRD, SEM, EDS, nanoindentation, ball friction and scratch test were used to test the structure and mechanical properties of the films. Doping Cr into the TaN film results in a decrease of the lattice constant and the film grain size. As Cr content increases, film hardness, cohesion and wear resistance are improved. When Cr content in Ta-Cr-N film reaches 29.5%, the film shows the highest hardness, the smallest grain size and the lowest wear rate.