Effective thermal management of electronic integrated devices with high powder density has become a serious issue,which requires materials with high thermal conductivity (TC).In order to solve the problem of weak bonding between graphite and Cu,a novel Cu/graphite film/Cu sandwich composite (Cu/GF/Cu composite) with ultrahigh TC was fabricated by electro-deposition.The micro-riveting structure was introduced to enhance the bonding strength between graphite film and deposited Cu layers by preparing a rectangular array of micro-holes on the graphite film before electrodeposition.TC and mechanical properties of the composites with different graphite volume fractions and current densities were investigated.The results showed that the TC enhancement generated by the micro-riveting structure for Cu/GF/Cu composites at low graphite content was more effective than that at high graphite content,and the strong texture orientation of deposited Cu resulted in high TC.Under the optimizing preparing condition,the highest in-plane TC reached 824.3 W·m-1·K-1,while the ultimate tensile strength of this composite was about four times higher than that of the graphite film.