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应用材料公司(Applied Materials Inl)宣布推出适用于300毫米硅片的SlimCell电化学镀系统(ECP)。该系统超越了现有电镀技术的极限,是一种高效经济,适用于当今130纳米和90纳米的制造技术,更为65纳米及日后的铜工艺芯片开发提供了突破性的功能。Slim Cell系统的关键所在,它在工艺控制和制造成本各方面为业界设置了新标准的同时,还实现了多级化学镀工艺控制处理。
Applied Materials Inl announced the SlimCell Electroless Plating System (ECP) for 300 mm silicon wafers. The system surpasses the limits of existing electroplating techniques and is a cost-effective and affordable manufacturing technology for today’s 130 and 90 nanometers, providing breakthrough capabilities for the development of 65-nanometer and future copper process chips. The key to the Slim Cell system is that it sets new standards for the industry in all aspects of process control and manufacturing costs while enabling multi-level electroless plating process control.