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研究了Ｐ／ＭＦＧＨ９５合金在１１２０℃固溶后以不同冷却速度（１２，２３，５６℃／ｓ）冷却，以及在１１６０℃固溶后缓冷（４℃／ｍｉｎ）到１１２０℃二次固溶后以１２℃／ｓ冷却的显微组织、力学性能和裂纹扩展速度。实验结果表明，１１２０℃固溶后随冷却速度加快，６５０℃的屈服强度和持久寿命增加，裂纹扩展速率提高。在１１６０℃＋１１２０℃二次固溶热处理后，因晶粒增大并产生部分弯曲晶界，６５０℃屈服强度只降低１３０ＭＰａ（约１２％），而裂纹扩展速率降低１０倍，持久寿命提高近两倍，并且消除了合金的缺口敏感性。
The P / MFGH95 alloy was cooled at 1120 ℃ and cooled at different cooling rates (12,23,56 ℃ / s) and slowly cooled (4 ℃ / min) at 1160 ℃ to The microstructure, mechanical properties and crack growth rate after cooling at 1120 ℃ after solution treatment at 12 ℃ / s were obtained. The experimental results show that the solid solution increases the cooling rate at 1120 ℃, and increases the yield strength and the long-term life at 650 ℃. The crack growth rate increases. After the second solution heat treatment at 1160 ℃ and 1120 ℃, the yield strength at 650 ℃ decreases by only 130MPa (about 12%) due to the grain growth and the partial bending of the grain boundaries, while the crack growth rate decreases by 10 times, Times, and eliminate the gap sensitivity of the alloy.