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在研究Ti—Ag—Cu法封接区域的物相转变的基础上,发展而成一种新的活性金属封接法—Cu_3Ti—Ag—Cu法。封接所使用的粉态Cu_3Ti,是从Ti—Cu或Ti—Ag—Cu合金中制取的。实验表明,Cu_3Ti—Ag—Cu法在封接强度、耐热冲击性能等方面均优于Ti—Ag—Cu法,平均封接强度可达1220公斤/厘米~2;对1毫米厚的无氧铜零件与95％Al_2O_3瓷的平封试验件,基本上能耐室温到500℃热冲击三次。封接样品经X射线分析,其过渡层为Cu_2(Ti,Cu)_4O。最后,对Cu_3Ti—Ag—Cu法95％Al_2O_3瓷与无氧铜封接的反应过程进行了初步的探讨。
On the basis of studying the phase transformation in the sealing area of Ti-Ag-Cu method, a new active metal sealing method-Cu_3Ti-Ag-Cu method was developed. Sealing used powder Cu_3Ti, is prepared from the Ti-Cu or Ti-Ag-Cu alloy. Experiments show that, Cu_3Ti-Ag-Cu method is superior to Ti-Ag-Cu method in terms of sealing strength, thermal shock resistance, the average sealing strength of up to 1220 kg / cm ~ 2; 1 mm thick anaerobic Copper parts and 95% Al_2O_3 porcelain flat seal test pieces, basically able to withstand room temperature to 500 ℃ thermal shock three times. Sealing samples by X-ray analysis, the transition layer Cu_2 (Ti, Cu) _4O. Finally, the reaction of 95% Al 2 O 3 porcelain with Cu 3 Ti-Ag-Cu method sealed with oxygen-free copper was discussed.