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研究了冷变形/时效处理对引线框架用Cu-Ni-Si-Mg合金金相组织、显微硬度及电导率的影响。结果表明:Cu-Ni-Si-Mg合金固溶后经冷轧变形,其等轴晶组织随变形量的增大,晶粒沿变形方向逐渐伸长,变形量越大,则伸长越显著,当变形量很大时,其组织呈纤维状;经形变处理后在相同温度条件下进行时效处理,时效初期显微硬度和电导率快速上升,随后到达峰值后并缓慢下降;Cu-Ni-Si-Mg合金固溶后经80%变形并在450℃时效6h后可得到良好的综合性能,此时显微硬度为305HV,电导率为36%IACS。
The effect of cold deformation / aging treatment on microstructure, microhardness and electrical conductivity of Cu-Ni-Si-Mg alloy for lead frame was studied. The results show that the deformation of the Cu-Ni-Si-Mg alloy after cold-rolling deformation, the equiaxed grain structure with the increase of deformation, the gradual elongation of the grain along the deformation direction, the greater the deformation, the more significant elongation , When the amount of deformation is large, the structure is fibrous; After the deformation treatment at the same temperature conditions aging, the early microhardness and conductivity increased rapidly, and then slowly decreased after reaching the peak; Cu-Ni- Si-Mg alloy solution after 80% deformation and aging at 450 ℃ 6h after a good overall performance can be obtained at this time the microhardness of 305HV, conductivity of 36% IACS.