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目前国外集成电路(IC)封装的主流是塑料封装,而且最常用的是环氧树脂低压递模法(transfer molding)的树脂封装.IC80%,分立器件90%以上,民用器件几乎100%采用塑料封装.其中环氧塑封占90%,硅酮塑封已退居次要地位.这种变化是由于管芯制造技术(钝化技术等)的进步和塑封材料可靠性的提高,日益扩大了塑封的适用范围.国外64KDRAM原来完全采用陶瓷封
At present, the mainstream of IC packaging in foreign countries is plastic packaging, and the most commonly used is resin encapsulation of epoxy resin transfer molding.Its 80% of IC, more than 90% of discrete devices, almost 100% of civilian devices are made of plastic Encapsulation, of which 90% of the epoxy plastic, silicone plastic has relegated to a secondary position.This change is due to the progress of the die manufacturing technology (passivation technology, etc.) and the improvement of the reliability of plastic materials, plastic packaging has expanded The scope of application. Foreign 64KDRAM original full ceramic seal