据美《科学日报》报道,包括密歇根州大学科学家在内的一个美国科学家小组,发现了一种可将计算机运行速度提高一倍的新型热电材料。当电流通过时,目前的热电材料温度可以下降60摄氏度,而这种新材料可以使这一下降幅度达到100摄氏度。最终它可以用于冷却计算机芯片,而计算机芯片在较低温度下运行效率要高得多。 According to the U.S. Science Daily, a team of U.S. scientists, including University of Michigan scientists, found a new type of thermoelectric material that can double the speed of computers. As the current passes, the current thermoelectric material temperature can drop 60 degrees Celsius, and this new material can make this decline to 100 degrees Celsius. Eventually it can be used to cool computer chips, while computer chips run much cooler at lower temperatures.