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现代电子封装迫切需要开发新型高导热陶瓷(玻璃)基复合材料.本文在对镀钛金刚石进行镀铜和控制氧化的基础上,利用放电等离子烧结方法制备了金刚石增强玻璃基复合材料,并观察了其微观形貌和界面结合情况,测定了复合材料的热导率和热膨胀系数.实验结果表明:复合材料微观组织均匀,Ti/金刚石界面是复合材料中结合最弱的界面,复合材料的热导率随着金刚石粒径和含量的增大而增加,而热膨胀系数随着金刚石含量的增加而降低.当金刚石粒径为100μm、体积分数为70%时,复合材料热导率最高达到了40.2W·m-1·K-1,热膨胀系数为3.3×10-6K-1,满足电子封装材料的要求.
Modern electronic packaging urgently needs to develop a new type of high thermal conductive ceramic (glass) matrix composites.In this paper, diamond-reinforced glass matrix composites were prepared by spark plasma sintering based on copper plating and controlled oxidation of titanium-coated diamond. The results show that the microstructures of the composites are uniform and the Ti / diamond interface is the weakest interface in the composites. The thermal conductivity of the composites Rate increases with the increase of diamond particle size and content, while the thermal expansion coefficient decreases with the increase of diamond content.When the diamond particle size is 100μm and the volume fraction is 70%, the thermal conductivity of the composite reaches up to 40.2W · M-1 · K-1, thermal expansion coefficient of 3.3 × 10-6K-1, to meet the requirements of electronic packaging materials.