用Ni-P合金为原料,加入SiC及BN等化合物的微细颗粒,经共析反应得到非电解电镀膜。非电解电镀是利用电镀液中物质(P、B)的相互作用进行还原,使材料表面形成镀膜,即使是形状复杂的零件,也可用此法得到无斑痕的均匀镀膜,机械及电性能良好。 Ni-P alloy as raw material, adding SiC and BN and other compounds of the fine particles, the eutectic reaction obtained by electroless plating film. Electroless plating is the use of the plating solution of the material (P, B) the interaction of reduction, the formation of coating the surface of the material, even the complex shape of the parts, can also be used to obtain a uniform coating without scratches, good mechanical and electrical properties.