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用现场椭圆术研究了在含ＫＦ的０．１ｍｏｌ／ＬＫＯＨ溶液中铜表面钝化膜的生长特性，Ｆ－主要影响氧化膜的生长，并促进了Ｃｕ以二价Ｃｕ２＋形式的溶解，而这往往伴随着应力腐蚀开裂的产生。现场椭圆术研究铜在含氟的碱性溶液中的电化学行为
The in-situ ellipsometry was used to study the growth characteristics of copper surface passivation films in 0.1 mol / L KOH containing KF. F- mainly affected the growth of the oxide film and promoted the dissolution of Cu in the divalent Cu 2+ form, which often Accompanied by stress corrosion cracking. Field Ellipsometry Electrochemical Behavior of Copper in Fluorine - Containing Alkaline Solution