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研究了Al-8Mg基体中添加Si对无压浸渗SiCp/Al复合材料显微组织和热导率的影响.结果表明,Si能够改善Al与SiC的润湿性,减少复合材料孔隙度,抑制界面反应,提高相对密度.不含Si时,Al与SiC界面反应严重,并且润湿性较差,导致复合材料的热导率和相对密度较低;当基体中添加质量分数12%的Si时,界面反应受到完全抑制,热导率取得最大值;进一步提高基体中Si含量,由于铝基体的热导率随Si含量的增加而降低,导致复合材料的热导率也随之降低.
The effect of adding Si on the microstructure and thermal conductivity of SiCp / Al composites without pressure infiltration was studied.The results show that Si can improve the wettability of Al and SiC, reduce the porosity of composites, Interface reaction and increase the relative density.When Si is not contained, the reaction between Al and SiC interface is serious and the wettability is poor, which leads to lower thermal conductivity and relative density of the composites. When adding 12% Si , The interface reaction is completely suppressed, and the maximum thermal conductivity is obtained. Further increasing the Si content in the matrix decreases the thermal conductivity of the aluminum matrix due to the decrease of the Si content, which leads to the decrease of the thermal conductivity of the composite.