本文根据粉末法渗硼层组织缺陷的金相、电镜观察和微区成分分析,探讨了硼化物表层孔洞及扩展裂纹的形态特征、失效方式、影响因素和依附关系,初步讨论了孔洞的成因。结果表明:孔洞系含有Si、S等元素的先天性裂源,渗层裂纹沿孔洞的薄弱路径扩展而引起龟裂和剥落,是渗硼件脆性失效的特有方式。据此,提出了减少孔洞的工艺途径。 According to the microstructure, electron microscopy and microscopic composition analysis of the microstructure defects of the boronizing layer by powder method, the morphological characteristics, failure modes, influencing factors and attachment of the surface pores and expanding cracks are discussed. The causes of the pores are discussed preliminarily. The results show that the pores contain congenital cleavage elements such as Si and S, and the cracks in the permeable layer extend along the weak path of the pores to cause cracking and spalling. This is a unique way for the brittle failure of boronizing parts. Accordingly, proposed to reduce the hole of the process.