采用SEM、XRD等手段对4种不同工艺制得的铜箔进行了表征,从微观晶体学结构的角度考察爆炸箔起爆器中桥膜的显微结构与其电爆炸性能的关系,讨论了薄膜电阻、晶界电阻、晶界数量、晶粒尺寸、晶粒取向等因素对金属薄膜电爆炸性能的影响,进而从微观层面上理解桥箔在冲击片雷管中的作用。 SEM and XRD were used to characterize the copper foil prepared by four different processes. The relationship between the microstructure of the bridge membrane and the electrical explosion performance was explored from the microscopic crystal structure perspective. The effects of the sheet resistance , Grain boundary resistance, the number of grain boundaries, grain size, grain orientation and other factors on the electrical explosion performance of metal thin film, and then from the micro-level to understand the role of bridge foil in the impact piece detonator.