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通过无铅焊膏的回流焊工艺窗口实验和工艺参数正交实验,分析了升温速率、峰值温度和熔点以上驻留时间对焊点形态的影响,确定了自制SAC305焊膏的合适工艺窗口和推荐工艺曲线参数。结果表明,自制焊膏的合适工艺窗口为峰值温度在焊料熔点以上20~30℃,熔点以上驻留时间60~80 s,长360 cm,宽30 cm的铁丝网型传送带速度为28 Hz。温区设定温度分别为190,210,230,260,285,300,280,265℃,这为工程实践中同类无铅焊膏的相关工艺制定提供了参考。
The effects of heating rate, peak temperature and dwell time above melting point on the morphology of solder joints were analyzed through orthogonal experiment of solder reflow process window and process parameters of lead-free solder paste, and the suitable process window of self-made SAC305 solder paste and the recommended Process curve parameters. The results show that the suitable process window of self - made solder paste is the wire conveyor belt speed of 28 Hz with the peak temperature of 20-30 ℃ above the melting point of the solder, 60-80 s above the melting point, 360 cm long and 30 cm wide. Temperature setting temperature 190,210,230,260,285,300,280,265 ℃, which for the engineering practice similar lead-free solder paste formulation provides a reference.