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作为设计工程师,您肯定对最新关于电子设备的环保法规有所耳闻,诸如RoHS、WEEE和无铅指令等。更多的法规还将陆续出台。这些法规无疑将影响作业及材料部门,但它们将如何影响设计工程师并不十分明了。例如,RoHS指令限制铅的使用意味着焊接、PC板及许多金属表面的镀层将发生变化,而这些都将影响电路的性能。为帮助您更好地理解这一重要话题,我们将在每期刊登一两篇有关无铅化/RoHS指令的简短但十分有价值的文章。此外,文章之后会附有一个列表,标明一些器件的最新无铅化/RoHS状态。
As a design engineer, you are sure to hear about the latest environmental regulations on electronic devices, such as RoHS, WEEE, and lead-free directives. More regulations will be introduced one after another. These regulations will undoubtedly affect the operations and materials departments, but it is not clear how they will affect design engineers. For example, the RoHS directive restricting the use of lead means that the solder, PC board and many metal surfaces will change coating, which will affect the performance of the circuit. To help you better understand this important topic, we will publish a short, but very valuable article on the issue of lead-free / RoHS one or two per issue. In addition, the article will be followed by a list of the latest lead-free / RoHS status for some devices.