论文部分内容阅读
第一部分、铜1概述在电镀中,铜与铜合金基体制件需作表面处理,镀取铜及铜合金也是用量较大的常规镀种之一。因此,无论作为金属还是其化合物,铜都是常接触的物质。
The first part, copper 1 Overview In electroplating, copper and copper alloy substrate parts needed for surface treatment, plating copper and copper alloy is a larger amount of conventional plating one. Therefore, whether as a metal or a compound thereof, copper is a frequently-contacted substance.