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在移动市场,音频保真度和功能不断推动创新,满足听音乐、看电影或打电话需求。因此,半导体供应商一直面临挑战,需要创造音频解决方案来满足音频端口和耳机的这些要求。本文将介绍一些新的解决方案,包括减少各种类型的咔嚓声和爆音并满足耳机的不同世界标准。过去几年,Bose、Sennheiser、Ultimate Ears、Monster和Harman Kardon等耳机制造商已与各大智能手机制造商(包括HTC、三星和苹果)结成联盟,屡推新品。产品多样化已将
In the mobile market, audio fidelity and features continue to drive innovation, listening to music, watching movies or making phone calls. As a result, semiconductor vendors have been challenged to create audio solutions that meet these requirements for audio ports and headsets. This article introduces some new solutions, including reducing various types of clicks and pops and meeting different world standards for headsets. Over the past few years, headphone makers such as Bose, Sennheiser, Ultimate Ears, Monster and Harman Kardon have made alliances with major smartphone makers, including HTC, Samsung and Apple, pushing new products. Product diversification has been