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塑料的热导率比金属材料低。然而,加入无机填料,特别是矿物填料可提高热导率。这种情况适用于由塑料导热的场合,如电气设备的壳体和绝缘部件、电缆绝缘、线路绝缘、集成电路和其他电子控制元件方面。环氧树脂和石英粉的混合物常用于上述这些场合。其机械性能和电气性能常有介绍。然而,这种复合材料的热导率却很少阐说。本文的目的是通过改变填料及其用量,来研究它们对这种复合材料热导率的影响。
Plastic thermal conductivity than metal materials. However, the addition of inorganic fillers, especially mineral fillers, can increase the thermal conductivity. This applies to applications that conduct heat from plastic, such as the shell and insulation of electrical equipment, cable insulation, line insulation, integrated circuits and other electronic control components. Mixtures of epoxy resin and quartz powder are commonly used in these applications. Its mechanical properties and electrical properties are often introduced. However, the thermal conductivity of this composite is seldom elucidated. The purpose of this paper is to study the effect of filler and its amount on the thermal conductivity of this composite.