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有机表面活性物质广泛地被用来控制各种电极过程的进行。在电镀、金属防腐等工艺中,使用了多种多样的“添加剂”、“光亮剂”和“绥蚀剂”。它们能够有效地改善电镀层的性质,或减缓金属电化学腐蚀的速度。生产实践和研究工作已表明,这些表面活性物质对电沉积过程的影响机理主要是通过它们能在电极/溶液界面上吸附而实现的。在金属电沉积过程中,阴极表面由于结晶的生长而不断地更新,同时有机添加剂不断吸附在金属的新鲜表面上,显著地影响着阴极反应的特征和电沉积层的形成。再则,由于电极表面有着在一定范围内可以连续变
Organic surface-active substances are widely used to control various electrode processes. In the electroplating, metal corrosion and other technology, using a wide range of “additives”, “brightener” and “eclipse agent.” They can effectively improve the nature of the plating, or slow down the rate of metal electrochemical corrosion. Production practices and research work have shown that the mechanism by which these surface-active substances affect the electrodeposition process is mainly through their ability to adsorb at the electrode / solution interface. During metal electrodeposition, the cathode surface is continuously renewed due to the growth of crystals, while the organic additives continuously adsorb on the fresh surface of the metal, significantly affecting the characteristics of the cathode reaction and the formation of the electrodeposited layer. In addition, because the electrode surface has a certain range can be continuously variable