给出了一种新型无引线表贴式微波模块设计方法。采用LTCC多层布线技术,运用垂直过渡方式实现微波信号从基板底部到表面的信号传输,完成表贴式互连结构设计。在DC-18GHz内,该表贴互连驻波小于1.5,插入损耗小于1.5dB(含测试盒插入损耗)。在此基础上设计、制作了一款表贴式X波段有源多功能模块,在9～10GHz内,测得噪声系数小于4dB,输出功率大于21dBm。尺寸仅为13×13×4.5mm3,重量小于3g。 A new design method of leadless surface mount microwave module is given. LTCC multi-layer wiring technology, the use of vertical transition mode to achieve the microwave signal from the bottom of the substrate to the surface of the signal transmission to complete the surface-mount interconnect structure design. In DC-18GHz, the surface-mounted intermodulation standing wave is less than 1.5, insertion loss is less than 1.5dB (including test box insertion loss). On this basis, a surface mount X-band active multi-function module is designed and manufactured. The noise figure is less than 4dB and the output power is more than 21dBm at 9 ~ 10GHz. Size is only 13 × 13 × 4.5mm3, weight less than 3g.