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电子工业部和中国电子学会于一九八六年一月十日至十五日在大连市联合召开了电子元器件引线可焊性(以下简称引线可焊性)技术攻关总结会议,全国部分省市电子工业主管部门、有关工厂、研究所和高等院校共92个单位186名代表参加了会议。会议进行了经验总结,技术总结,展审了攻关成果,讨论了今后措施,表彰了先进单位。与会代表一致认为,会议开得是好的,是一次成果检阅和技术总结的会议。三、技术攻关情况电子工业部党组在一九八○年电子工业领导干部会议上提出引线可焊性技术攻关任务,部于一九
The Ministry of Electronics Industry and the Chinese Institute of Electronics held a concluding meeting on solderability (hereinafter referred to as solderability of leads) of electronic components in Dalian from January 10 to January 15, 1986. Some provinces Municipal electronics industry authorities, the factories, research institutes and colleges and universities a total of 92 units of 186 representatives attended the meeting. The meeting conducted a summary of experiences, technical summary, examining the achievements of the research, discussed future measures and commended advanced units. The participants agreed that the meeting was a good start, is a result review and technical summary of the meeting. Third, the technological research and the situation The Ministry of Electronics Industry Ministry Party Committee in the leading cadres of the electronics industry in 1980 proposed lead solderability technology research mission, in 19