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中国电子科技集团公司第十三研究所研制的3D微封装射频/微波模块,采用国内领先的锡球垂直互连多层板工艺。Ku频段接收双通道可实现超小尺寸(≤20 mm×15 mm×5.5 mm)、超轻重量(≤5 g)。产品最高频率可突破20 GHz,内部隔离效率大于70 d B;采用表面贴装结构,非常适合紧凑空间应用;高可靠,高性能,最高可满足宇航等级要求;内部标准化设计,可保证快速交货。我们的目标是为全球的微波射频组件用户提供高性能、
China Electronics Technology Group Corporation thirteenth Institute developed the 3D micro-packaging RF / microwave module, the use of the domestic leading solder ball vertical interconnect multilayer technology. Ku-band dual-channel receiver can achieve ultra-small size (≤ 20 mm × 15 mm × 5.5 mm), ultra-light weight (≤ 5 g). The highest frequency of the product can exceed 20 GHz, the internal isolation efficiency is greater than 70 dB; Surface mount structure, very suitable for compact space applications; High reliability, high performance, the highest to meet the aerospace grade requirements; Internal standardized design to ensure fast delivery . Our goal is to provide users of microwave radio frequency components worldwide high performance,