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环氧树脂在电子工业中的应用,主要在于粘合、浇铸、层压及涂复等方面.环氧树脂是一种新型树脂,它有下列特点:第一,硬化时体积收缩率很低,最大不超过2.5%;第二,硬化时无挥发物质,如水、氨等;第三,硬化时不需要加压,根据需要可在高温或室温硬化;第四,硬化后具有良好的机械性能和电性能;第五,具有反好的抗化学药品性和绝缘性;第六,粘合能力强,除了对少数塑料,例如聚乙烯、聚四氟乙烯、聚苯乙烯、聚
Epoxy resin in the electronics industry, mainly in the bonding, casting, lamination and coating etc. Epoxy resin is a new type of resin, which has the following characteristics: First, the volume shrinkage is very low when hardened, The maximum does not exceed 2.5%; second, no volatile substances such as water, ammonia and the like when hardened; thirdly, no pressure is needed when hardened, and can be hardened at high temperature or room temperature according to need; fourth, good mechanical properties after hardened Fifth, with good anti-chemical properties and insulation; Sixth, strong adhesion, except for a few plastics, such as polyethylene, polytetrafluoroethylene, polystyrene, poly