在氯化铜存在下的盐酸溶液中,用溶解的分子氧溶解铜的动力学研究,是采用下述条件进行的:HCl浓度——0.1—3mol dm~(-3),氧分压——20—100kPa,CuCl的初始浓度——0.01mol dm~(-3),温度—318—328K。若氯化铜的浓度高于0.01mol dm~(-3)时,铜的溶解速度呈现一级动力学反应,其表观活化能为32kJ mol~(-4)。溶解速度也受Cl~-离子活度的影响,并呈示出与Langmuir型吸附有相似性。在采用的试验条件下,H~+离子和氧分压对溶解速度没有什么影响。 Kinetics studies of the dissolution of copper with dissolved molecular oxygen in a hydrochloric acid solution in the presence of cupric chloride were carried out using the following conditions: HCl concentration - 0.1-3 mol dm ~ (-3), partial pressure of oxygen - 20-100kPa, CuCl initial concentration - 0.01mol dm ~ (-3), temperature -318-328K. If the copper chloride concentration is higher than 0.01mol dm ~ (-3), the dissolution rate of copper exhibits a first order kinetic reaction with an apparent activation energy of 32kJ mol ~ (-4). The dissolution rate is also affected by the Cl ~ - ion activity and shows similarities with the Langmuir-type adsorption. Under the experimental conditions adopted, H ~ + ions and partial pressure of oxygen had no effect on the dissolution rate.