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提出一种MEMS高频电磁局部感应加热封装的方法,并将其应用于圆片级感应局部加热封装.为达到MEMS圆片级封装键合,通过数值模拟和实验研究,首先设计与优化感应器的结构,其次验证PCB板在感应器内的加热情况,初步实现了MEMS在均匀磁场中的均匀局部感应加热封装.结果表明:采用局部感应加热封装,可有效降低封装过程中热对芯片的影响,可大大减小芯片的热应力,有效提高MEMS器件的寿命.
A MEMS high frequency electromagnetic local induction heating packaging method is proposed and applied to wafer-level induction local heating packaging. In order to achieve MEMS wafer-level packaging bonding, through numerical simulation and experimental research, the design and optimization of the sensor , And then verify the PCB board in the sensor heating situation, the initial MEMS uniform uniform induction heating in uniform magnetic field package.The results show that: the use of local induction heating package, the packaging process can effectively reduce the impact of heat on the chip , Can greatly reduce the chip thermal stress, effectively improve the life of MEMS devices.