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铜加入微量的铋,将引起明显的沿晶断裂。在400-700℃范围内时效后,断口由发展得很好的小面组成。扫描电子显微镜虽能很好地显示断口形貌,却不能给出结晶学上的参数。反射电子显微术已成功地揭示了铂、金、半导体等晶体表面的微观结构,但尚未用来观察断口表面。本文利用反射电子显微术能同时给出表面形貌和电子衍射图的优点,观察渗铋的铜双晶沿晶断裂表面的结晶学上的特征。
Copper added trace amounts of bismuth will cause significant intergranular fracture. After aging in the range of 400-700 ° C, the fracture consists of well-developed facets. Scanning electron microscopy can show the fracture surface morphology, but can not give the crystallographic parameters. Reflecting electron microscopy has successfully revealed the microstructure of the crystal surfaces of platinum, gold, semiconductors and the like, but has not been used to observe the fracture surface. In this paper, the advantages of surface morphology and electron diffraction patterns can be given by reflection electron microscopy, and the crystallographic characteristics of the copper bismuth intermetallic fracture surface were observed.