随着在一个小小的硅片中集成的电子元件越来越多,用于检测其故障的技术也越来越复杂。英国卫星试验中心用电子显微镜检测芯片故障。日本三菱公司的有关人员正力图利用激光探测线路结构的方法加速检测超大规模集成芯片的过程。 As more and more electronic components are integrated into a tiny piece of silicon, the technology used to detect failures is becoming more sophisticated. British satellite test center electron microscopy chip failure. Relevant personnel from Japan’s Mitsubishi Corporation are trying to speed up the process of testing VLSI chips by using the laser detection circuit structure.