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微电子学的重要基础技术之一是精密加工技术。在所有的零件微小型化的微电子学方面,不用说,精度非常高的精密加工技术是必要的。本文叙述了用于零件相互间或零件内部电气连接、零件封入用的焊接、精密材料的切割、打孔、小型熔合等的几种过去采用的加工方法和今后将采用的新加工法。这些加工法中,照相腐蚀法广泛应用于半导体工业,而超声波加工法用于陶瓷的加工及引线的焊接和锡焊等。电子注加工法、光量子放大器加工法等新加工法也很引人注目。其次阐述了精密加工技术的现状及存在的问题等。
Micro-electronics is one of the important basic technology of precision machining technology. Needless to say, in the microelectronics aspect of all the miniaturization of components, precise machining with very high precision is necessary. This article describes several past processing methods used in the past for electrical interconnections between parts or parts, soldering of parts for sealing, cutting of precision materials, drilling, mini-fusing, and new processing methods to be adopted in the future. Among these processing methods, the photolithographic method is widely used in the semiconductor industry, while the ultrasonic processing method is used for the processing of ceramics and the soldering and soldering of lead wires. Electronic injection processing method, light quantum amplifier processing method and other new processing method is also very attractive. Second, elaborated the current situation of the precision machining technology and the existing problems and so on.