论文部分内容阅读
详细描述一种等离子体高效溅射系统及应用工艺。此种崭新的溅射技术结合了蒸发镀的高效及溅射镀的高性能特点,特别在多元合金以及磁性薄膜的制备,具有其他手段无可比拟的优点。
Detailed description of a high-efficiency plasma sputtering system and application process. This new sputtering technology combines the high performance of evaporative plating with the high performance of sputter plating, especially in the preparation of multivariate alloys and magnetic films with unparalleled advantages over other approaches.