电子设备和其它设备一样,采用折衷方法是不可避免的。在微处理机中,由于它们固有的复杂性,允许微处理机取代硬布线的逻辑板,但随之也带来下述问题:由于器件的复杂性随着用途的增加而不断增加,使用之前如何对这些复杂的器件进行充分的测试是个需要解决的问题。半导体制造厂对产品至少进行两次测试:第一次是在薄片试样阶段,挑出明显不合格的产品;第二次是在最后测试阶段,对封装 Electronic devices As with other devices, the trade-off is inevitable. In microprocessors, because of their inherent complexity, allowing microprocessors to replace hard-wired logic boards, the attendant problems are as follows: As device complexity increases with usage, prior to use How to fully test these complex devices is a problem to be solved. The semiconductor manufacturer at least twice tested the product: the first is in the thin sample stage, pick out the product obviously failed; the second is in the final test phase, the package