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采用EBSD取向成像技术研究了各工艺参数(功率、载荷、超声作用时间)对倒装键合组织及微织构的影响,并与对应的剪切性能值进行比较。结果表明,功率的影响最显著,它可在增大形变量的同时提高键合强度;负荷加大形变量,但提高界面结合强度的效果不显著;超声持续的时间不明显提高形变量,但能在一定程度上提高界面强度。超声是通过软化金属,加强界面扩散的方式提高键合强度;超声的存在使取向变化的速度变慢。
The influence of process parameters (power, load and ultrasonic action time) on the flip-chip bonded structure and the micro-texture was studied by EBSD imaging technology and compared with the corresponding shear properties. The results show that power has the most significant effect. It can increase the amount of deformation while increasing the bonding strength. The load increases the amount of deformation, but the effect of increasing the bonding strength is insignificant. The duration of ultrasound does not significantly increase the amount of deformation, To a certain extent, improve the interface strength. Ultrasound improves the bonding strength by softening the metal and strengthening the interface diffusion. The presence of ultrasound makes the orientation change slower.