论文部分内容阅读
针对目前市场上金相试样电解抛光设备的成本高、体积大、自动化程度低等问题,设计了一套基于嵌入式系统的电解抛光控制系统。系统以MSP430F1612微处理器为核心,通过对电流、电压以及温度等模拟量的采集和控制,实现了对电解抛光过程各个参数的测控。实验测量数据表明,系统达到了预期的参数指标,降低了成本,提高了自动化程度,对实际应用具有一定的指导意义。
In view of the high cost, large volume and low degree of automation of the metallographic sample electropolishing equipment on the market, a set of electrolytic polishing control system based on embedded system is designed. System MSP430F1612 microprocessor as the core, through the acquisition of current, voltage and temperature analog and control, to achieve the various parameters of the electrolytic polishing process control. Experimental measurement data show that the system has reached the expected parameters, reduce costs and improve the degree of automation, the practical application of a certain significance.