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TSV转接板组装工艺过程引起的封装结构翘曲和应力对微凸点可靠性有重要影响。该文采用有限元方法,分析了TSV转接板封装自上至下和自下至上两种组装工艺流程,通过比较工艺应力/应变和翘曲得到较优工艺流程;针对优选工艺流程,分析了不同工艺步微凸点的力学行为,重点关注封装结构中微凸点定位对微凸点可靠性的影响。结果表明:自上至下组装工艺流程较优;微凸点位置设计应尽量避开下填料边缘,当微凸点正好位于TSV上方时,微凸点阵列塑性功密度最低,且分布均匀,微凸点的这种定位设计最为合理。
TSV adapter plate assembly process caused by the package structure warpage and stress on the reliability of micro-bump has a significant impact. In this paper, finite element method is used to analyze the top-down and bottom-up assembly process flow of TSV adapter plate, and the better process flow is obtained by comparing the process stress / strain and warpage. According to the optimized process flow, The mechanical behavior of micro-bump in different process steps is focused on the influence of micro-bump positioning on the reliability of micro bump in the package structure. The results show that the assembly process is superior from top to bottom. The design of the micro-bump should be designed to avoid the edge of the underfill. When the micro bumps are located directly above the TSV, the micro-bump array has the lowest plastic work density and uniform distribution. This bump positioning design is the most reasonable.