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一、概述 用硅酮塑料包封电子器件是电子工业中正在发展的一项新技术和新工艺。在过去,电子器件的包封材料多用陶瓷,玻璃和金属。硅酮塑料跟它们比较起来,性能上固有得失,但它却具有塑料容易成型加工的最大优点。用它作为包封材料不仅可以使电子器件的包封微型化,适应尖端技术和国防建设的需要,而且更为突出的是,可以使电子器件的包封吸收先进的塑料成型技术,大大简化包封工艺,减少设备投资,变过去的逐个包封为成批包封,从而使电子器件的成本大幅度地下降,更好地满足工农业发展的需要。因此,电子器件的硅酮塑料包封是包封工艺中的一场革命,具有巨大的经济效果,对促进电子工业的进一步发展具有重大的意义。
First, an overview Encapsulation of electronic components with silicone plastic is the electronics industry is developing a new technology and new technology. In the past, encapsulants for electronic devices were mostly made of ceramics, glass and metal. Compared with them, silicone plastic inherent performance gains and losses, but it has the greatest plastic forming the most advantages. Use it as the encapsulation material can not only miniaturize the encapsulation of electronic devices, adapt to the needs of cutting-edge technology and national defense construction, but also more prominent is that the encapsulation of electronic devices can absorb the advanced plastic molding technology, greatly simplifying the package Encapsulation process, reduce equipment investment, change from one package to another encapsulation, so that the cost of electronic devices dropped significantly to better meet the needs of industrial and agricultural development. Therefore, the silicone encapsulation of electronic devices is a revolution in the encapsulation process, with great economic effects, which is of great significance to the further development of the electronic industry.