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热失效是影响半导体器件的性能和可靠性的主要原因,热特性和温度测量是整个电子系统热设计过程中的关键环节。光学测量方法具有非接触、无损伤的优势,在半导体及电子系统研究领域应用日益广泛。评述了各种半导体器件热特性光学测量技术的工作原理、实验装置、技术指标、应用现状,总结了现有方法中的关键问题和发展方向。
Thermal failure is the main factor that affects the performance and reliability of semiconductor devices. Thermal characteristics and temperature measurement are the key steps in thermal design of the entire electronic system. Optical measurement methods have the advantages of non-contact, non-destructive, in the field of semiconductor and electronic systems increasingly widely used. The working principle, experimental device, technical index and application status of optical measurement technology for thermal characteristics of various semiconductor devices are reviewed. The key problems and development directions of the existing methods are summarized.