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针对金刚石的钎焊问题，利用扫描电镜和电子探针分析、Ｘ射线能谱分析、Ｘ射线结构分析等方法，对Ａｇ－Ｃｕ－Ｔｉ钎料在金刚石表面的润湿状况进行了试验研究．结果表明，含Ｔｉ量对钎料的润湿状况有一定影响、界面间Ｃ，Ｔｉ元素的扩散及ＴｉＣ的形成有助于改善钎料的润湿状况．
In order to solve the problem of diamond brazing, the wettability of Ag-Cu-Ti solder on the diamond surface was investigated by scanning electron microscopy and electron probe analysis, X-ray energy spectrum analysis and X-ray structure analysis. The results show that the content of Ti has a certain influence on the wettability of the solder. The interfacial diffusion of C, Ti and the formation of TiC help to improve the wettability of the solder.