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引言近年来为了更多地了解晶体的结构缺陷(如位错,层错和沉淀等)对晶体的化学,电性和机械性能的影响,导致了许多检验方法,如腐蚀法,缀饰法、扫描电子显微镜法、电子显微镜薄膜技术以及X射线形貌术等。其中除了X射线形貌术外,其它均需破坏样品或需制备特殊的样品,而X射线法却具有非破坏性,并能作为暴露有关晶体及器件中结构缺陷而控制质量的一种工具。它主要的缺点是分辨率较差和曝光时间长。利用X射线形貌术探索晶体中缺陷与性能关系方面的工作,国外近几年才较快的发展起来。我们在这方面的工作刚刚开始。我们选用工业上应用最广的半
INTRODUCTION In recent years, many test methods have been introduced in order to know more about the crystal structure, such as dislocations, stacking faults and precipitations, on the chemical, electrical and mechanical properties of crystals, such as corrosion method, embellishment method, Scanning electron microscopy, electron microscopy film technology and X-ray topography. In addition to the X-ray topography, the others require sample destruction or special preparation, whereas the X-ray method is nondestructive and can be used as a tool to control the quality of the crystal and the structural defects in the device. Its main disadvantage is the poor resolution and long exposure time. The use of X-ray topography to explore the relationship between crystal defects and performance of the work, the rapid development in recent years abroad. Our work in this area has just begun. We use the most widely used industrial half