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为研究热塑性聚酰亚胺(TPI)薄膜的力学性能,对其母材试件(M50)和两种不同焊接工艺的焊接薄膜试件(C50、T50)进行单轴拉伸试验。试验结果与分析表明:TPI薄膜母材M50的屈服强度约为40.1 MPa,焊接膜材C50、T50的屈服强度分别为34.4 MPa、39.6 MPa。薄膜母材与焊接薄膜的抗拉强度及弹性模量基本一致。焊接温度影响TPI焊接膜材的屈服应力,不同焊接工艺对TPI焊接薄膜的抗拉强度及弹性模量无显著影响。
In order to study the mechanical properties of thermoplastic polyimide (TPI) films, uniaxial tensile tests were carried out on the base metal specimens (M50) and two welded film specimens (C50, T50) with different welding processes. The test results and analysis show that the yield strength of TPI film base metal M50 is about 40.1 MPa and the yield strength of welded film C50 and T50 is 34.4 MPa and 39.6 MPa respectively. Film base metal and welding film tensile strength and elastic modulus are basically the same. The welding temperature affects the yield stress of TPI welding film, and the different welding process has no significant effect on the tensile strength and elastic modulus of TPI welding film.