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在Fab里,在经过特别设计的短流程测试晶圆上进行的快速电学测试和自动FIB/SEM缺陷分析可以将不可见缺陷探测与分析的时间降低一个数量级,并且对不同的设计参数非常敏感,因而有足够的样本来做重要的统计评估。
In the Fab, rapid electrical testing and automated FIB / SEM defect analysis on specially designed short-flow test wafers reduce the time to detect and analyze invisible defects by an order of magnitude and are sensitive to different design parameters, Therefore, there are enough samples for important statistical evaluation.