美国GCG Technologies Inc.公司研发出一种被称作Deflex Process的机器零件高效无污染清洗技术。DF技术用超临界液体CO2代替氟氯烃(CFCS)清除电子器械和光电产品上的油脂,塑料、聚合材料上的污染物,多孔金属表面污物,机加工和冲压件表面的油污等。清洗过程是将液态CO2在30℃和7550 kPa压力下通入盛有零件的容器。将含有大量污垢的溶液自容器泵 GCG Technologies Inc. of the United States has developed a highly efficient non-polluting cleaning technology for machine parts known as the Deflex Process. DF technology uses supercritical liquid CO2 instead of chlorofluorocarbons (CFCS) to remove grease, plastics, polymeric contaminants, porous metal surfaces, machined and stamped surfaces on electronic devices and optoelectronics. The cleaning process is to pass liquid CO2 into the container containing the parts at a pressure of 3050C and 7550 kPa. The solution containing a large amount of dirt from the container pump