热分析在光电模块可靠性设计上的应用研究

来源 :激光与光电子学进展 | 被引量 : 0次 | 上传用户:xxhaizi
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元器件计数法是目前国内外针对光电模块可靠性设计的通用方法,为了改善没有成熟光电模块产品就无法有效进行可靠性预计的问题,在产品设计阶段通过运用流体仿真分析软件以XFP(10 G小型可插拔)模块为例模拟分析其在不同温度条件下的工作状态。完成了XFP模块的热分析,给出了XFP模块可靠性设计的优化办法,得到了XFP模块可靠性预计的具体量化结果,实现了在设计阶段针对光电模块产品可靠性进行定量分析。 Component counting method is a universal method for the reliability design of photovoltaic modules at home and abroad. In order to improve the reliability prediction that can not be carried out effectively without mature photovoltaic module products, the fluidic simulation software XFP (10 G Small pluggable) module as an example to simulate the analysis of its work under different temperature conditions. The thermal analysis of the XFP module is completed, and the optimization method for the reliability design of the XFP module is given. The quantitative results of the reliability prediction of the XFP module are obtained. The quantitative analysis of the reliability of the photovoltaic module is implemented in the design phase.
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