论文部分内容阅读
通过在轧制成片状的Al-12Si钎料表面上分别电镀Cu层和Ni层制得复合钎料,研究了该钎料钎缝的成形机制。结果表明,该复合钎料的钎焊机制仍然以接触反应为主。Ni元素阻止了Cu层与母材的过早接触,促使Cu层与Al-Si合金优先反应。液相首先在该界面处产生,随着液相的增多,Ni层破碎,大部分镀Ni层在钎缝形成过程中随多余熔融钎料被排出钎缝,仅小部分Ni残留在焊缝中。由于Ni层的阻挡,减小了Cu对母材的溶蚀,提高了钎料的润湿性,改善了接头性能。
The forming mechanism of the solder brazing seam was studied by plating the Cu layer and the Ni layer on the surface of Al-12Si brazing filler metal. The results show that the brazing mechanism of the composite brazing filler metal is still mainly contact reaction. The Ni element prevents premature contact of the Cu layer with the base material, prompting preferential reaction of the Cu layer with the Al-Si alloy. The liquid phase is first generated at the interface. As the liquid phase increases, the Ni layer breaks. Most of the Ni-plated layer is removed with excess molten solder during braze seam formation, leaving only a small portion of Ni remaining in the weld . Due to the barrier of the Ni layer, the corrosion of the base metal by Cu is reduced, the wettability of the solder is improved, and the joint performance is improved.