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2002年,由于半导体市场崩落,硅圆片需求量也比2001年大幅下降了29%,但 SOI圆片的需求却继续维持了16%的增长率,预计从2002年到2007年间的年均增长率将高达47%。除了 IBM 已开始大量生产 SOI 器件之外,今后 AMD 等先进器件生产公司也将大量生产数据处理用的 SOI 器件。由于追求器件的高速化和低电压化,今后超薄膜 SOI 器件的需求将劲增。此外,目前主要应用200 mm圆片,未来几年将加速向300mm 转移,预计2007年300 mm 圆片使用量将占一半。
Demand for silicon wafers fell sharply by 29% in 2002 as a result of the recession in the semiconductor market, but demand for SOI wafers continued to grow at a 16% rate, projected to average between 2002 and 2007 The rate will be as high as 47%. In addition to IBM has begun mass production of SOI devices, the future of AMD and other advanced device manufacturing companies will also mass production of SOI devices for data processing. As the pursuit of high-speed devices and low voltage, the future demand for ultra-thin film SOI devices will surge. In addition, the main application of 200 mm wafer, the next few years will be accelerated to 300mm transfer, 2007 300 mm wafer usage is expected to account for half.