许多工业界观察家预计,在同一封装中并合数字功能和模拟功能的专用集成电路(ASIC)将以惊人的速度增长。但是,在实现这一潜在的增长之前,必须找到解决并合型设计手段中现有故障的方法、测试仪器、测试方法,以及用户的专门设计技能等。不幸的是,来自需求的压力已超过工艺技术的能力。 Many industry observers expect that the application-specific integrated circuits (ASICs) that combine digital functions and analog functions in the same package will grow at an alarming rate. However, before this potential growth can be achieved, methods, test equipment, test methods, and user-specific design skills must be found to address existing problems in the design process. Unfortunately, the pressure from demand has surpassed that of process technology.