元器件集成化和产品小型化带来的突出问题之一,是随着功率密度的提高,散热问题成为影响电子设备可靠性和寿命的重要环节。为解决面临的新的散热课题,必须采用新的散热方式和新的散热器件。面对高功率密度(组件级高达4W/cm~2)、严格的噪声限制、高可靠性、低性能价格比等的要求,在散热方式和器件的发展方向上有2种意见。由军用电子设备引伸出来的见解是,提倡采用能防尘、防潮(防腐)、防电磁干扰的闭式冷却系统,与之相应需使用技术比较复杂、成本比较高的散热系统。另一种意见认为强迫风冷系统有其独特的优点:系统简单可靠,易接近内部元器件,成本低,易维护。目前可行的选择是:功率密度较小、运行于良好环 One of the outstanding problems caused by the integration of components and miniaturization of products is that with the increase of the power density, the heat dissipation problem has become an important link that affects the reliability and life expectancy of electronic equipment. In order to solve the new cooling problem that faces, must adopt the new cooling way and new heat sink device. The face of high power density (component level up to 4W / cm ~ 2), strict noise limits, high reliability, low cost performance requirements, in the cooling mode and the device has two views on the direction of development. The idea extended by the military electronic equipment is to advocate the use of closed cooling system that can be dust-proof, moisture-proof (anti-corrosion) and anti-electromagnetic interference. Correspondingly, the cooling system with more complicated technology and higher cost should be used accordingly. Another view that forced air cooling system has its unique advantages: the system is simple and reliable, easy access to internal components, low cost, easy to maintain. The current options are: smaller power density, running in a good ring