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新SKiN技术使电流密度倍增近期,赛米控开发出新的功率半导体封装技术,摒弃了接合线、焊接和导热涂层。新的SKiN技术采用挠性箔片和烧结连接,而非绑定线、焊接和导热涂层。与采用标准绑定线连接技术所实现的1.5A/cm~2电流密度相比,新技术的电流密度实现了倍增,达到3A/cm~2。因此,该转换器体积减少了35%。这种可靠且节省空间的技术是汽车和风力发电应用的最佳解决方案。有了SKiN技术,现在有可能将一个3MW的风力发电转换器放进一个开关柜中。另一个例子是用于混合动力汽车和电动汽车的90kW转换器,该转换器的体积比当今市场上最小的转换器还小35%。
New SKiN technology to double the current density Recently, SEMIKRON developed a new power semiconductor packaging technology, leaving the bonding wire, welding and thermal coating. The new SKiN technology uses flexible foils and sintered connections instead of bonding wires, soldering and thermal coatings. The new technology achieves a current density of 3 A / cm ~ 2 compared to 1.5 A / cm ~ 2 current density achieved with standard bonding wire bonding technology. Therefore, the converter volume is reduced by 35%. This reliable and space-saving technology is the best solution for automotive and wind power applications. With SKiN technology, it is now possible to put a 3MW wind turbine converter in a switch cabinet. Another example is the 90kW converter for HEVs and EVs, which is 35% smaller than the smallest converter on the market today.