电子器件用的瓷件是一种切削性能较差的材料,它不但坚硬而且极易崩裂。为满足工艺质量要求,一般压制成形后的零件,多采用金刚砂轮磨削,或采用钢丝等加工方法。但当瓷件形状复杂、精度要求高,孔径小又带钱度台阶时,磨削加工极为困难。用一般工具磨床磨削,因砂轮线速度低,磨削速? Ceramic parts for electronic devices are poorly machinable materials that are not only hard but also crackable. To meet the quality requirements of the process, the general shape of the parts after pressing, and more use of emery wheel grinding, or using wire and other processing methods. However, when the porcelain pieces of complex shape, high precision, small aperture and money with a step, the grinding is extremely difficult. Grinding with a general tool grinder, because the wheel speed is low, grinding speed?